1. Self-healing of Cracks in Ag Joining Layer for Die-attachment in Power Devices
    C. Chen, S. Nagao, K. Suganuma, J. Jiu, H. Zhang, T. Sugahara, T. Iwashige, K. Sugiura, K. Tsuruta
    Appl. Phys. Lett, 109,093503(2016).
  2. Dry-growth of Silver Single-crystal Nanowires from Porous Ag Structure
    C. Chen, S. Nagao, J. Jiu, H. Zhang, T. Sugahara, K. Suganuma
    Appl. Phys. Lett. 108, 263105 (2016).
  3. Modifying the Valence State of Molybdenum in the Efficient Oxide Buffer Layer of Organic Solar Cells via a Mild Hydrogen Peroxide Treatment
    S. Cong, A. Hadipour, T. Sugahara, T. Wei, J. Jiu, S. Ranjbar, Y. Hirose, M. Karakawa, S. Nagao, T. Aernouts and K. Suganuma
    J. Mater. Chem. C, 5, 889–895 (2017).
  4. Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design
    C. Chen , S. Nagao, H. Zhang, J. Jiu, T. Sugahara, K. Suganuma, T. Iwashige, K. Sugiura, K. Tsuruta
    Journal of Electronic Materials  46 (3), 1576–158613 (2017).
  5. Macroscale and Microscale Fracture Toughness of Microporous Sintered Ag for Applications in Power Electronic Devices
    C. Chen, S. Nagao, K. Suganuma, J. Jiu, T. Sugahara, H. Zhang, T. Iwashige, K. Sugiura,  K. Tsuruta
    Acta Materialia 129 (2017) 41–51.
  6. Die Bonding Performance Using Bimodal Cu Particle Paste Under Different Sintering Atmospheres
    Y. Gao, H. Zhang, W. Li, J. Jiu, S. Nagao, T. Sugahara, K. Suganuma
    Journal of Electronic Materials 46, 7, 4575-4581(2017).
  7. Printable and Flexible Copper-silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance
    W. Li, D. Hu, L. Li, C. Li, J. Jiu, C. Chen, T. Ishina, T. Sugahara, K. Suganuma
    ACS Appl. Mater. Interfaces, 9, 29, 24711–24721 (2017).