11/21/2024
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2015FY

  1. Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
    Y.-S. Kim, S. Nagao, T. Sugahara, K. Suganuma, M. Ueshima, H.-J. Albrecht, K. Wilke, J. Strogies
    Journal of Electronic Materials, 43, 12, 4428-4434 (2014).
  2. Heel Crack Propagation Mechanism of Cold-rolled Cu/Al Clad Ribbon Bonding in Harsh Environment
    S. Park, S. Nagao, T. Sugahara, K. Suganuma
    Journal of Materials Science: Materials in Electronics; 26(9), pp. 7277-7289(2015).
  3. Ultra Thermal Stability of LED Die-attach Achieved by Pressureless Ag Stress-migration Bonding at Low Temperature
    T. Kunimune,  M. Kuramoto, S. Ogawa, T. Sugahara, S. Nagao, K. Suganuma
    Acta Materialia , Volume 89, Pages 133–140 (2015).
  4. The Effect of Light and Humidity on the Stability of Silver Nanowire Transparent Electrodes
    J. Jiu, J. Wang, T. Sugahara, S. Nagao, M. Nogi, H. Koga, K. Suganuma, M. Hara, E. Nakazawa, H. Uchida
    RSC Advances, 2015, 5, 27657-27664 (2015).
  5. Surface Modification of Cu Flakes Through Ag Precipitation for Low-temperature Pressureless Sintering Bonding
    S.W. Park, T. Sugahara, M. Hatamura, N. Kagami, S. Sakamoto, S. Nagao, K. Suganuma
    Materials Letters 151, 18546, 68–71 (2015).
  6. Growth and Extension of One-Step Sol − Gel Derived Molybdenum Trioxide Nanorods via Controlling Citric Acid Decomposition Rate
    S. Cong, T. Sugahara, T. Wei, J. Jiu, Y. Hirose, S. Nagao, K. Suganuma
    Cryst. Growth Des. 15, 9, 4536–4542 (2015).
  7. Facile Identification of the Critical Content of Multi-layer Graphene Oxide for Epoxy Composite With Optimal Thermal Properties
    T. Zhou, S. Nagao, T. Sugahara, H. Koga, M. Nogi, K. Suganuma, T. T. Nge, and Y. Nishina
    RSC Advances 5, 26, 20376–20385 (2015).
  8. Targeted Kinetic Strategy for Improving the Thermal Conductivity of Epoxy Composite Containing Percolating Multi-layer Graphene Oxide Chains
    T. Zhou, H. Koga, M. Nogi, T. Sugahara, S. Nagao, T. T. Nge, K. Suganuma, H.-W. Cui, F. Liu, and Y. Nishina
    Express Polymer Letters 9, 7, 608–623 (2015).