2018FY

Printable and Flexible Copper-silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance
W. Li, D. Hu, L. Li, C. Li, J. Jiu, C. Chen, T. Ishina, T. Sugahara, K. Suganuma
ACS Appl. Mater. Interfaces, 9, 29, 24711–24721 (2017).
Ethanol Gas Sensing Performance of High-dimensional fuzz Metal Oxide Nanostructure
K. Ibano,Y. Kimura, T. Sugahara, H.-T. Lee, Y. Ueda
Japanese Journal of Applied Physics, 57, 4, 040316 (2018).
Electrodeposition and Growth Mechanism of Preferentially Orientated Nanotwinned Cu on Silicon Wafer Substrate
F.-L. Sun, L.-Y. Gao, Z.-Q. Liu, H. Zhang, T. Sugahara, S. Nagao, K. Suganuma
Journal of Materials Science and Technology 34, 10, 1885-1890 (2018)
Thin Film of Amorphous Zinc Hydroxide Semiconductor for Optical Devices with an Energy-Efficient Beneficial Coating by Metal Organic Decomposition Process
M. Karakawa, T. Sugahara, Y. Hirose, K. Suganuma, Y. Aso
Scientific Reports, 2018, 8, 10839.
Fabrication with Semiconductor Packaging Technologies and Characterization of a Large-Scale Flexible Thermoelectric Module
T. Sugahara, Y. Ekubaru, N. V. Nong, N. Kagami, K. Ohata, L. T. Hung, M. Okajima, S. Nambu, and K. Suganuma
Advanced Materials Technologies, 2018, 1800556 (2018).
Thermal shock reliability of a GaN die-attach module on DBA substrate with Ti/Ag metallization by using micron/submicron Ag sinter paste
Dongjin Kim, Chuantong Chen, Chun Pei, Zheng Zhang1, Shijo Nagao, Aiji Suetake, Tohru Sugahara, and Katsuaki Suganuma, Japanese Journal of Applied Physics, 58 (2019) SBBD15, DOI: 10.7567/1347-4065/ab0278